Toppan, ULMA Packaging, Microchip Technology, Blecon: RFID News Roundup

Published: June 13, 2024

Toppan Develops Coreless Organic Interposer for Next-Generation Semiconductors

Toppan has addressed a challenge for heterogeneous integration of semiconductors by developing a high-reliability coreless organic interposer1 for next-generation semiconductors with a new product.

With this new coreless organic interposer, Toppan has used a material with a low coefficient of thermal expansion (CTE) to reinforce both sides of the redistribution layer (RDL). While supporting fine pitch interconnections and a low CTE, the simple coreless structure also rigidity.

The CTE is approximately 45% lower than conventional packaging substrates, making it possible to prevent cracks that arise due to differences between the CTEs of FC-BGA substrates and RDLs, according to the company. The narrow pitch mold resin through-mold via (TMV) structure enables fine routing/fine interconnection with a minimum connection terminal pitch of 40μm on the chip side and 130μm on the substrate side. Due to the scalability of panel level manufacturing, large sizes of more than 100 mm sq. can be supported.

The interposer itself can be independent from the carrier, what officials statis delivers the world’s first organic interposer for which standalone electrical inspection assurance is possible. Reliability is thus enhanced, making it possible to contribute to a significant reduction in loss due to chip disposal resulting from interposer defects.

ULMA Packaging Develops New Feature For RFID-Based Maintenance System 

ULMA Packaging has developed a new feature aimed at facilitating maintenance tasks based on RFID sensors. This new feature complements the previous format control system, which was already available and designed to prevent operational errors during format changes.

In line with the goal of maximizing equipment availability to improve the OEE of the packaging lines, company officials said they are committed to developing new utilities that simplify machine operation and reduce downtime.

This new utility offers the possibility of having a cycle counter and an individual alarm for each mould in the traysealer. Through these alerts received on the machine’s HMI, the operator can schedule the appropriate maintenance tasks, thus avoiding unexpected production stoppages.

Microchip Adds 12 Products Reduce Barriers to Bluetooth

Microchip Technology has expanded its Bluetooth Low Energy (BLE) portfolio with 12 new products, aimed at providing designers with an extensive array of choices to tackle their unique challenges, effectively lowering barriers across designs spanning from the simplest to the most advanced.

The additions include the RF-ready WBZ350 module and the PIC32CX-BZ3 SoC that offers the lowest entry point available for integrating a Bluetooth Low Energy microcontroller (MCU) into product designs.

In addition to its Bluetooth MCUs, Microchip introduced the RNBD350 plug-and-play module that reduces the cost and complexity barriers to adding Bluetooth Low Energy connectivity to product designs. These modules minimize the time, money and engineering resources required for RF design optimization, regulatory certification and software development. For experienced engineers who are looking for more flexibility, Microchip offers robust wireless, multi-protocol MCU System-on-Chip (SoC) options.

“The power of choice is increasingly critical when adding Bluetooth to any type of product,” said Rishi Vasuki, vice president of Microchip’s wireless solutions business unit. “Developers need options and the ability to switch between them as their skills and application needs evolve.”

Sample applications for Microchip’s BLE parts include IoT smart home and building systems, Industrial IoT (IIoT) solutions and automotive designs. Designers using the newly expanded BLE portfolio for entry-level applications benefit from an easy development process, including in-house support services and development tools, without compromising Bluetooth functionality, according to company officials.

Blecon Unveils Bluetooth LE-based IoT Connectivity Solution

Blecon is announcing the availability of a new IoT connectivity solution based on Bluetooth Low Energy (BLE). This innovative solution addresses the challenges faced by companies in applying BLE to IoT Connectivity, offering a practical approach that simplifies and democratizes the use of Bluetooth for IoT applications.

Blecon, a technology company founded by seasoned IoT experts from ARM, AWS, and Microsoft, is launching a solution that builds on the Bluetooth standard by incorporating a robust architecture, advanced security measures, and essential components to enable seamless communication between devices and cloud applications via nearby Hotspots, according to company officials.

Simon Ford, CEO of Blecon, said BLE is now being used ever more widely in IoT Connectivity use-cases, building upon technical and commercial success in personal connectivity and tracking beacons. “

Despite the challenges companies face in adapting BLE for these applications, the benefits are driving adoption,” said Ford in a press statement. “At Blecon, we leverage our deep expertise in the IoT industry and our specialized experience with BLE to provide a solution that simplifies and democratizes the use of Bluetooth Low Energy for IoT Connectivity”

The key components of Blecon’s offering are modems, hotspots, and networks. Blecon’s technology is packaged as a comprehensive product and network service designed for integration. This solution empowers businesses to leverage the full potential of BLE, unlocking new possibilities for IoT connectivity applications.

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