Latest In: MCU

BLE Blecon Bluetooth Low Energy coefficient of thermal expansion CTE IIoT Industrial IoT interposer1 IoT Connectivity MCU Microchip Technology microcontroller RDL redistribution layer RFID Rishi Vasuki semiconductors Simon Ford Toppan ULMA Packaging
RFID Roundup

Toppan, ULMA Packaging, Microchip Technology, Blecon: RFID News Roundup

Toppan Develops Coreless Organic Interposer for Next-Generation Semiconductors Toppan has addressed a challenge for heterogeneous integration of semiconductors…

News June 13
Abdul Salam international Center for theoretical physics Universidad federal de Itajuba AI AI on the Edge artificial intelligence Columbia University Daryl Khoo data centers environmental impact facial recognition Food/Agriculture Harvard University insect identification IoT IoT sensor Logistics machine learning Marcelo Rovai MCU medical applications Microcontroller Units Renesas Electronics RFID Supply Chain TinyML TinyML4D Ledu learning open education initiative TinyMLedu UNIFEI wildfire detection
AI on the Edge

AI on the Edge

Research projects aim to bring AI to the physical world Researchers are proving that bringing AI to IoT…

News April 8