- The deal combines Kigen’s eSIM IoT Remote Manager (eIM) solution and Nordic’s award-winning nRF9151 System-in-Package (SiP).
- The collaboration underscores both companies’ commitment to offer IoT solutions that remove the technical barriers to wireless connectivity and enable rapid scalability
Nordic Semiconductor and Kigen recently announced a technical collaboration that will accelerate Massive IoT deployments.
The partnership combines Kigen eSIM IoT Remote Manager (eIM) solution for SGP.32 IoT eSIMs and Nordic’s award-winning nRF9151 System-in-Package (SiP). Company officials said the collaboration underscores their commitment to offer robust, secure, low-power cellular IoT solutions that remove the technical barriers to wireless connectivity and enable rapid scalability of the IoT.
Vincent Korstanje, CEO, Kigen, offered the joint testing between reflects both companies shared commitment to innovation in low-power, compact, and battery-efficient IoT devices.
Nordic-Kigen Partnership
“At Kigen, this is part of our vision to ensure that standards bring benefits to the broadest set of players – making this transformative technology accessible, cost-effective, and scalable for businesses of all sizes,” said Korstanje.
Officials from both companies highlighted the collaboration between exemplifies a shared commitment to delivering robustly tested, high-quality solutions for low power, compact IoT designs. Such products are critical for the success of Massive IoT deployments such as industrial automation, asset tracking, and smart metering.
The open work has resulted in successful testing of the eIM platform and eSIM on the nRF9151 and sets the stage for further trials and support for commercial deployments in early 2025. Both Kigen’s eIM solution and Nordic’s nRF9151 are available now.
Technical Details
“The collaboration with Kigen has produced an outcome that’s much more than just an important technical milestone,” says Oyvind Birkenes, EVP Business Unit Long-Range, Nordic Semiconductor.
The GSMA’s SGP.32 standard simplifies Remote SIM Provisioning (RSP) for resource- and network-constrained low-power IoT devices. Kigen eIM brings market-leading capabilities to coordinate, streamline, and simplify remote eSIM profile management for low-power IoT devices at scale, according to company officials.
With the Kigen solution, SIM profile management and RSP are accessible to all small and medium enterprises (SMEs) making them broadly applicable to the Massive IoT market for the first time.
IoT Connection
With a Kigen eSIM, Nordic’s Nordic Thingy:91 X connects to the eIM platform to perform SIM profile changes. Thingy:91 X is an advanced cellular IoT prototyping platform built around the nRF9151 SiP and supporting LTE-M, NB-IoT, GNSS, Bluetooth LE, Wi-Fi, and DECT NR+ wireless standards.
For eSIM profile management and RSP development purposes, the Thingy:91 X resembles a low-power IoT device with an embedded application that communicates with the IoT Profile Assistant (IPA) in the eSIM to help supervise the full set of profile operations, including profile switch. The combination of Thingy:91 X, eSIM, and eIM solution is ideal for developers looking to fast-track IoT developments, according to Nordic officials.
The Kigen eIM solution with Nordic nRF9151 SiPs is currently available for customer trials, with commercial deployment slated for early 2025.
“Rather, the simplicity brought by Kigen’s solution combined with the highly integrated, low power, and cost-efficient nRF9151 SiP has the potential to transform the cellular IoT landscape by making it easier and faster for all sizes of companies to deploy Massive IoT applications,” stated Nordic Semiconductor’s Birkenes.