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Packaging/Labeling Discussion


RFID Packaging

By R. Carson 2005-07-24 04:20:33 AM

I invite you to visit our website, www.innovatier.com, and learn more about our new patented Reaction Injection Embedding technique that is now being used to encapsulate RFID components into a ruggidized package.

The versatility of our molding process provides a wide range of shapes and forms that can be used without compromising component integrity while significantly enhancing the strength of your finished device.

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TOPIC DATE
RFID Packaging
By R. Carson
07.24.2005

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