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Honeywell launches online store to streamline access to business-critical software ••• Smart Packaging Solutions intros prelaminate to simplify payment card manufacturing ••• ADLINK partners with Google Cloud to offer IoT-ready solutions ••• Packet launches automated IoT service with Microsoft Azure ••• C3 releases development environment for enterprise AI.
By Rich Handley

Smart Packaging Solutions Intros Prelaminate to Simplify Payment Card Manufacturing

Smart Packaging Solutions (SPS) has announced a new generation of its eBoost PAY inductive coupling technology with SPS's 150µm SLam G2. With this thinner prelaminate, payment card vendors can simplify their production process, the company reports, as they can now manufacture all cards with a single body structure.

For instance, if card manufacturers are under pressure from customers to support various assembly technologies and deal with multiple suppliers for each subpart, they can have their logistics dramatically simplified. As all prelaminates have the same thickness (150µm), the company explains, card vendors can be certain they will make standard-compliant cards with a single supply of PVC card bodies. In this way, they have only one type of PVC inventory to manage, leading to reductions in logistics and supply chain costs.

Since the S-Lam G2 prelaminates are 150µm in thickness, this leaves more space in the 0.76-mm card's total thickness to have a thicker PVC printed core, according to the company. Silk-screen printing is thus made easier and delivers a better quality on thicker card bodies, the firm notes, with no risk of warp or shrinkage. The thinner 150µm S-Lam G2 prelaminates mean less material to transport between SPS's factories and the card manufacturer; this reduces transportation costs, according to SPS, while decreasing the ecological footprint of the entire card manufacturing process.

Jean-Baptiste Leos, SPS's banking product marketing director, said in a prepared statement: "At SPS, we care about the industrial process of our customers. With S-Lam G2, card manufacturers will get an ever-improving industrial process that simplifies their logistics, makes printing easier and reduces their transport costs."

The S-Lam G2 offers the same features as the original eBoost PAY technology, based on electromagnetic coupling between the antenna and the module (with no physical connection between the chip and the antenna), the company reports, and allows for an increase in total manufacturing capacity. The eBoost PAY system helps to ensure that cards are reliable and durable, the firm explains.

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