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RFID News Roundup

JADAK offers UHF RFID smart module for OEMs ••• Identiv, NXP Semiconductors collaborate on NFC inlay for Internet of Things ••• KLAS Research honors CenTrak for its RTLS offerings ••• Cisco intros new switches, router for IoT environments ••• Dartford and Gravesham NHS Trust reduces hospital readmissions via remote patient monitoring ••• STMicroelectronics unveils energy-efficient step-down converters for IoT devices ••• Decawave provides secure mobile transactions for consumer devices via UWB chipsets ••• Industrial Internet Consortium, Openfog Consortium unite ••• NFC Forum signs IoT liaison agreement with AIM, expands automotive partnership with JasPar.
By Rich Handley

Identiv, NXP Semiconductors Collaborate on NFC Inlay for Internet of Things

Identiv has announced a new RFID inlay in collaboration with NXP Semiconductors. Using NXP's NTAG 210µ Near Field Communication (NFC) IC, Identiv's Dry Inlay measures 25 millimeters (1 inch) in diameter and has been launched at a price of $0.05 per tag. Compatible with most NFC-enabled devices (Android or Apple iOS 11 and above), the inlay enables such NFC use cases as Internet of Things (IoT) and customer-engagement applications.

Identiv's Dry Inlay design, including a chip, an antenna and an inlay, can be directly embedded in or converted into finished products. Suitable applications include the IoT, NFC smart posters and billboards, libraries, event and transportation ticketing, the automotive and chemical industries, logistics and supply chain, asset management, pharmaceuticals and health care, fast-moving consumer goods, beauty care, spirits, device authentication and counterfeit protection, electronic games, event management, wearable technology and customer loyalty programs.

"The proliferation of NFC-enabled smartphones and other consumer electronic devices allows companies to engage directly with their end-customers. Identiv helps them make this happen," said Manfred Mueller, Identiv's COO and general manager for identity, in a prepared statement. "Our expertise lies in the design and production of inlay designs integrating various materials, chip technologies, and frequencies for metal and non-metal environments."

As part of our comprehensive portfolio, we offer state-of-the-art, contactless-based inlays to guarantee superior quality performance for practically any application," Mueller added in the prepared statement. "Leveraging the quality of NXP chips, Identiv continues to ideally position NFC for easier integration and adoption in different markets, while also allowing straightforward migration from barcodes/QR codes to powerful, flexible NFC technology."

"NXP develops silicon-based solutions for customer needs in connectivity and smart applications – from reliable, cost-efficient implementations to more advanced, feature-rich security offerings, like our recently announced NTAG 424 DNA solution," said Alexander Rensink, NXP's business segment manager of smart products, in the prepared statement. "Based on the cost-optimized NTAG 210µ, Identiv's new ultra-low-cost NFC tags are perfectly suited to companies looking to deploy quality, off-the-shelf connectivity. By working with Identiv, we further our commitment to see NFC everywhere by enabling a new generation of smart products across a wide range of end markets where NFC may have been previously considered price prohibitive."

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