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RFID News Roundup
NXP offers larger silicon wafers to boost RFID chip production capacity, sustainability ••• NFC RFID technology from Smartrac and FinnCode adds music to kids' book ••• CYBRA intros RFID-enabled safety solution for real-time tracking of people, assets ••• RAIN Alliance publishes new document on RFID reader sensitivity testing ••• Extronics launches iRFID500 handheld UHF RFID reader for hazardous areas ••• Avery Dennison invests in flexible electronics company PragmatIC ••• Italian bus company uses beacon-based gamification to boost ridership, protect environment ••• Janam's XT2 rugged, RFID-enabled mobile computer certified for IntelliTrack's Android app ••• RFID tags give researchers new insight into hummingbird migration behaviors.
Oct 20, 2016—
The following are news announcements made during the past week by the following organizations: NXP Semiconductors; Smartrac, FinnCode; CYBRA Corp.; the RAIN RFID Alliance; Extronics; Avery Dennison, PragmatIC; Onyx Beacon, SASA; Janam Technologies, IntelliTrack; and the University of Toronto Scarborough.
NXP Offers Larger Silicon Wafers to Boost RFID Chip Production Capacity, Sustainability
NXP Semiconductors is offering new 12-inch silicon wafers for long-range semiconductor devices, as an alternative to the current industry-standard 8-inch wafers, in order to enable a significant increase in production capacity, improved assembly quality and efficiency, and, most importantly, a reduction in manufacturing waste and electricity. Avery Dennison is the first to provide RFID inlays with NXP's new 12-inch offering.
A larger wafer diameter allows more RFID chips to be produced from a single wafer, Avery Dennison and NXP report, thereby doubling the number of dies per wafer compared with existing 8-inch wafer formats. This increased use of existing materials can simultaneously reduce both chemical and packaging waste and energy consumption.
Avery Dennison says it plans to utilize the chips with its SmartFace Technology, which removes the plastic material in RFID products and replaces it with a paper substrate to reduce environmental impact. SmartFace Technology has already been used to make a number of Avery Dennison RFID inlays, the firm notes, and the introduction of the new wafer will reduce the environmental impact of RFID solutions further.
Both Avery Dennison and NXP say they are committed to the development of sustainable products, materials and manufacturing processes for semiconductor technologies.
"Bringing together both parties' expertise, Avery Dennison and NXP introduce this innovation for more sustainability in semiconductor industry," said Ralf Kodritsch, NXP's segment manager for RFID solutions, in a prepared statement. "Our collective responsibility drives us to work collaboratively to address the environmental and social impacts of our solution proactively, while the 12-inch wafers significantly increases NXP's supply capacity."
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