Qorvo Offers new SoC for Smart Devices
Qorvo has launched a new system-on-chip (SoC) solution for smart home devices. The QPG6200Lis a next-generation IoT system incorporates the company’s ConcurrentConnect technology, offering multi-network support for Matter, Zigbee, and Bluetooth Low Energy (BLE) while ensuring exceptional energy efficiency in a scalable turnkey solution.
The QPG6200L is the first product utilizing low-power wireless networking platform from Qorvo, aimed at tackling contemporary smart home landscape issues by facilitating seamless communication and compatibility among various wireless standards, according to company officials.
The chip, now in the testing phase with major clients, concurrently supports numerous protocols over distinct channels, providing superior RF performance and reliability for various consumer IoT applications, such as smart lighting, sensors, and home hubs. It utilizes an integrated secure element and is PSA Certified Level 2 for improved IoT security.
Samples and development kits for the QPG6200L SoC are currently available, with full production scheduled for early 2025.
BleedIO Tech First-time Exhibitor at CEDIA Expo
BleedIO Tech recently featured its netMESH, an alternative to traditional smart home standards that is promoted as promising a decentralized, self-healing, and self-organizing network, as a first-time exhibitor at CEDIA Expo.
The product is a software solution based on the Bluetooth Low Energy (BLE) mesh standard. Unlike traditional IoT networks, netMESH’s decentralized, self-healing, and self-organizing network eliminates single points of failure, ensuring continuous operation even in the event of individual device failures.
“During CEDIA 2024, we had more than 90 home integrators sign up for pilot tests of our groundbreaking netMESH product,” said Lee Beup, BleedIO Tech CMO.
Company officials describe netMESH as addressing some of the most pressing challenges in IoT—downtime, poor interoperability, and complex network management—while setting new standards for network resilience and security. The product can be seamlessly integrated into various smart home and industrial applications, offering cost savings and operational efficiencies.
New Rubber Duck Antennas Offered from L-com
L-com has added a new line of rubber duck antennas, a compact and flexible omnidirectional antennas for easy installation and adjustment that are suitable for low-power applications.
The antennas come in three main frequency bands: 2.4 GHz, 433 MHz and 916 MHz. The 2.4 GHz antennas are commonly used to extend the range of Wi-Fi routers, improve the signal strength of Bluetooth devices and enhance the function of cordless telephones.
The 433 MHz antennas are a good match for industrial remote controls, tire pressure monitoring and keyless entry systems. The 916 MHz antennas extend the reach and reliability of short-range radio applications, such as wireless alarm systems and industrial telemetry.
“Our new line of rubber ducks helps round out our already extensive selection of compact omnidirectional antennas,” said product line Manager Kevin Hietpas. “The newly designed mini antennas with solder posts are perfect for direct-to-board applications.”
Applications for L-com’s new rubber duck antennas include Wi-Fi, Bluetooth, IoT, both fixed and mobile devices, LPWAN, ISM, LoRaWAN, Sigfox, Weightless-P, Wi-Fi HaLow, Zigbee and more.
ST, Qualcomm Team for Intelligent Wi-Fi, Bluetooth and Thread Modules
STMicroelectronics and Qualcomm have agreed to integrate Qualcomm’s Wi-Fi, Bluetooth and Thread wireless IC into STM32 development tools.
This collaboration will see the two companies integrate Qualcomm Technologies’ leading AI-powered wireless connectivity technologies, starting with Wi-Fi/Bluetooth/Thread combo system-on-a-chip (SoC), with the market-leading microcontroller (MCU) ecosystem from ST.
Through this collaboration, developers will enjoy connectivity software integration into STM32 general-purpose MCUs, including software toolkits, facilitating quick and broad adoption via ST’s world-wide sales and distributor channels.
Remi El-Ouazzane, president, microcontrollers, digital ICs and RF products group, for STMicroelectronics said “wireless connectivity is key to the fast pervasion of edge AI across an ever-growing variety of use cases in enterprise, industrial and personal applications. This is why we are establishing a strategic collaboration with Qualcomm Technologies on wireless connectivity.”
Focusing on the broader market, ST plans to introduce self-contained modules utilizing Qualcomm’s Wi-Fi/Bluetooth/Thread combo SoC portfolio, which can be system-level integrated with any STM32 general-purpose microcontrollers. Wireless connectivity optimized and made available to ST’s developer ecosystem through ST’s well established software platform will contribute to reducing development time and time-to-market.
“Our collaboration with STMicroelectronics pairs Qualcomm Technologies’ best-in-class connectivity offerings with ST’s leading STM32 microcontroller ecosystem will help drive a significant acceleration of feature-rich capabilities across the IoT,” said Rahul Patel, group general manager, connectivity, broadband and networking business unit for Qualcomm Technologies. “Together, we are setting new developer experiences for IoT applications, supporting seamless integration and optimal performance for developers and end-users alike.”
The initial product offerings resulting from this collaboration are expected to be available to OEMs in Q1 2025, with broader availability to follow.