Hewlett Packard Enterprise, Intel Team Up for IOT Solutions
Hewlett Packard Enterprise (HPE) and Intel have partnered to create and deliver new Internet of Things solutions. The two companies also intend to open three global IoT solutions labs to help customers with their IoT technology deployments. The three new IoT Discovery Labs will be located at HPE’s existing facilities in Houston, Texas; Grenoble, France; and Singapore.
In developing Internet of Things solutions, the companies intend to combine HPE’s existing IoT technology and IT expertise with Intel’s IoT software platform and products designed to collect, process and analyze data collected from sensors and other networked devices. The IoT solutions will also include Intel’s Core i5 and Atom processors.
Sierra Wireless Releases AirLink Raven RV50 Gateway
Internet of Things company Sierra Wireless has released a gateway intended to provide machine-to-machine (M2M) connectivity in industrial applications. The AirLink Raven RV50 gateway, which the company calls the industry’s lowest-power 4G LTE gateway, is built to be rugged and is designed for use in harsh and hazardous environments.
Sierra Wireless reports that the Raven RV50 can serve as a gateway for IoT applications, such as video surveillance for security. The device functions as part of a comprehensive solution for customers allowing the fast transmission of data to users regarding incidents in the field.
The Raven RV50 includes the ALEOS Application Framework (AAF), an embedded programming system for onboard data gathering, real-time data processing and alert generation. The application framework also enables the delivery of real-time data and information, reliably and securely via LTE networks, to the Sierra Wireless IoT Acceleration Platform or to other software applications and operational systems.
In addition, the company reports, the AirLink Raven RV50 offers SIM-based network operator switching. Users can insert the SIM card into the gateway, and it will automatically configure the new network settings.
Due to its low power consumption (less than 1 watt in idle mode), the Raven RV50 provides an alternative for remote industrial infrastructures, in which applications are typically battery or solar powered.
Hirschmann Solutions Offers Asset-Tracking Modules
Machine-to-machine (M2M) technology firm Hirschmann Solutions is offering three new asset-tracking modules as part of a full platform solution for container, trailer and chassis tracking. The three modules are the HS-2000 series (for containers), the HS-2100 series (for trailers) and the HS-2200 series (for chassis).
All three series include sensors for monitoring movements, temperatures, vibrations and locations. The modules are intended to enable logistics companies and solution providers to choose from a variety of products for monitoring container freight, for example, to maintain cold chains, as well as entire transport routes.
The base module for the entire HS-2X00 series is fitted with a subscriber identity module (SIM) chip, making it possible to quickly switch between network providers. An upgrade to 4G LTE networks will be available in the future, according to the company. Modules can also work with Bluetooth Low Energy (BLE) wireless technology, to which devices within a radius of approximately 30 meters (98.4 feet) can connect. Firmware and software updates can be performed by the control center via over-the-air (OTA) programming.
Bluetooth Special Interest Group Plans Extended Range, Faster Speed, Mesh Networking
The Bluetooth Special Interest Group (SIG), a Bluetooth standards organization, has released its 2016 Bluetooth technology roadmap.
Once adopted, the new specification is intended to provide developers with the flexibility to quadruple the range of devices using Bluetooth Smart technology (also known as Bluetooth Low Energy, or BLE), which could extend coverage from within a room to across an entire house. The specification also optimizes responsiveness with a 100 percent increase in speed.
A third new feature will be mesh networking. Bluetooth devices will be able to connect to each other to form networks for a building or an industrial installation, thereby enabling a greater number of IoT deployments using Bluetooth technology.
Additional features and profile updates contained in the 2016 roadmap will be previewed during the coming months, the organization reports. The Bluetooth Smart Mesh Working Group will adopt the new specifications next year. The Bluetooth SIG expects these advancements will energize the growth of Internet of Things applications, such as smart homes, industrial automation, location-based services and smart infrastructure.
Sigfox IoT Network Rolling Out in Ireland
VT Networks and 2RN, an Irish communication-network operator and infrastructure provider, are deploying a network of Sigfox access points across Ireland. VT Networks, Sigfox’s network operator in that country, expects to enable the connection of one million IoT and machine-to-machine (M2M) devices by 2017.
With the Irish deployment, Sigfox is continuing its global expansion. The company already has networks installed in 12 countries, including parts of the United States.
STMicroelectronics Releases Product-Development Ecosystem for Secure Payments, New 32-Bit Secure Microcontroller
Global semiconductor company STMicroelectronics is selling a new product-development ecosystem intended to simplify the addition of secure mobile transactions to wearable devices. The solution is intended to help product designers integrate security in systems for payment, ticketing, digital-access and loyalty-card applications within wearable form factors, using the device’s main microcontroller with a hardware security element providing protection against malicious attacks.
The new ecosystem provides a secure microcontroller, a Near Field Communication (NFC) controller, a removable NFC antenna and a set of software building blocks, as well as a choice of expansion boards that contain ST’s ST31 secure microcontroller or ST54 system-in-package (SiP). The ST31-based design is intended for VIP banking applications, such as smart bands that support credit-card functionality, while the ST54 can support original equipment manufacturer (OEM) NFC-payment devices.
The chip company has also announced the release of a third-generation secure microcontroller (known as the ST33J2M0) in its ST33 series based on ARM‘s 32-bit SecurCore SC300 processor. The new microcontroller provides what the company calls the largest flash program memory (2 megabytes), as well as integrated crypto-accelerators to enable high-performance, fast application execution.
Samples of the ST33J2M0 are being provided by ST as wafers, or built into VQFN and WLCSP packages.