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Common Challenges of Lower-Technology Nodes for IoT Devices
The Internet of Things has become a mainstream technology for companies seeking to accelerate the growth of chip connectivity. Engineers are struggling to find a way to manage the inherent difficulties.
Testing to Enhance Performance
Wire Interconnecting Delay
There are other suites of services, like Netlist to GDSII, Sign-off, Design for Testability, ATPG Challenges and Double Patterning in lower-technology nodes, which can enable service providers to address advanced fabrication process and ensure the right quality of silicon, every time. With this in mind, it's vital to consider how the IoT relates to Moore's law and challenges faced by the semiconductor industry to scale IoT applications.
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Komal Chauhan works in the marketing department at eInfochips, where she supports digital marketing and content-writing activities in semiconductor and IoT applications that help companies to take advantage of product-engineering services in a dynamic market. With the encouragement of friends and colleagues, Komal started writing about evolving technology trends. She can be reached at firstname.lastname@example.org, or you can connect with her on LinkedIn.
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