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Common Challenges of Lower-Technology Nodes for IoT Devices

The Internet of Things has become a mainstream technology for companies seeking to accelerate the growth of chip connectivity. Engineers are struggling to find a way to manage the inherent difficulties.
By Komal Chauhan

Testing to Enhance Performance
As the size of a transistor is reduced, this gives rise to solid-state drive (SSD) fault defects. Thus, it becomes difficult for companies to diagnose defects on a frequent basis, identify the suitable design-for-test (DFT) techniques, and reduce costs and time-to-market so as to power up the performance of chips.

Wire Interconnecting Delay
As chip size shrinks, engineers face challenges in scaling wire length. In addition, it becomes difficult in the case of fine-pitched wires to leverage lower-design technology density and limit complexity. Thus, challenges of scaling and interconnectivity between wires limit the performance and connectivity of devices in the IoT ecosystem.

Figure 1: Node Processing Flow Chart (Credit: wisc.edu)
Due to a continuous reduction in lower-geometry design, the semiconductor industry follows architectural and node-processing-based techniques in developing and implementing new nodes. The architecture-based technique upgrades a new set of processors, based on micro-architecture for large performance upgrades. The node-processing-based technique consists of a switch, a buffer and other functional units (see Figure 1).

There are other suites of services, like Netlist to GDSII, Sign-off, Design for Testability, ATPG Challenges and Double Patterning in lower-technology nodes, which can enable service providers to address advanced fabrication process and ensure the right quality of silicon, every time. With this in mind, it's vital to consider how the IoT relates to Moore's law and challenges faced by the semiconductor industry to scale IoT applications.

You may also like to watch a video:
Role of Semiconductors in the IoT Era of Networking Industry

Komal Chauhan works in the marketing department at eInfochips, where she supports digital marketing and content-writing activities in semiconductor and IoT applications that help companies to take advantage of product-engineering services in a dynamic market. With the encouragement of friends and colleagues, Komal started writing about evolving technology trends. She can be reached at marketing@einfochips.com, or you can connect with her on LinkedIn.

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