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Common Challenges of Lower-Technology Nodes for IoT Devices
The Internet of Things has become a mainstream technology for companies seeking to accelerate the growth of chip connectivity. Engineers are struggling to find a way to manage the inherent difficulties.
Feb 11, 2018—
In 1965, Gordon Moore, a co-founder of Intel, observed that the number of transistors per square inch on integrated circuits has doubled approximately every two years since the IC was invented. This is known as Moore's law, and it has helped in the evolution of smaller, cheaper, more powerful devices, which has led to consumers taking computing technologies for granted.
As the semiconductor industry races toward lower-technology nodes, the focus now is on more powerful chips with reliable Internet of Things (IoT) support. Considering this, the IoT has become a mainstream technology for companies looking to accelerate the growth of chip connectivity in the upcoming years.
If you pay attention to the emerging changes in the semiconductor industry, you will notice that the market has seen a continuous discussion about tape-out on 16-nanometer and 10-nanometer lower geometries, even hitting the 7-nanometer wall and beyond for developing high-performance systems after only a few days. With regard to this ongoing trend of diminishing transistor geometries, engineers are struggling to find a way to manage the difficulties inherent to lower-technology nodes. Some common challenges engineers face are as follows:
Companies are increasingly facing the challenge of reducing the sizes of transistors and technology nodes without affecting the performance of chips in order to meet the consumer demand for IoT products. Chip manufacturers, therefore, are looking for IoT components that are as small as possible, which results in good RF performance and affordability.
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