RFID JournalRFID Journal ESPAÑOLRFID Journal BRASILRFID Journal EVENTSRFID Journal AWARDSRFID CONNECT
Home Internet of Things Aerospace Apparel Energy Defense Health Care Logistics Manufacturing Retail

Plasma Joins RFID Chips, Antennas

Two partnering companies will use plasma deposition technology to bond RFID chips directly to antennas and produce low-cost EPC tags in 2005.
By Jonathan Collins
Oct 26, 2004Nanotechnology specialist Ionic Fusion Corp. (IFC) has partnered with RF systems manufacturer RF Identics to produce low-cost item-level EPC tags ready for shipment by the second quarter of next year. The tags will be manufactured using IFC’s Ionic Plasma Deposition (IPD) technology.
IFC's Joe Ryan

The IPD technology can be used to deposit ionized metallic atoms and molecules onto a wide variety of materials, including ceramics, polymers, paper, quartz, metals and composites. The process uses a vacuum to remove all contaminants and can run at room temperature, although the process’s operating temperature can be higher or lower, if desired.

IFC says its proprietary technology offers higher efficiency and cost-effectiveness over traditional metallization processes and, by being able to create a metallic layer that penetrates surfaces, provides better adhesion to substrates. The company believes that its high-speed deposition process can be used to bond an RFID chip directly to an antenna to create a complete RFID inlay. IFC claims that it has developed improvements to its IPD technology to bring to the RFID tag and label manufacturing process.

“We have a new material and a new way to manufacture the tag antenna, as well as a new way to attach a chips [to antennas] without using adhesive,” says Joe Ryan, president of IFC, which is based in Longmont, Colo. He maintains that compared with other existing inlay-production techniques, which use an electrically conductive glue to bond an RFID chip to an antenna, his company’s IPD technology produces tags that perform more reliably and cost less.

“Our tags and labels will offer savings from the high yields of working tags that our process makes possible,” Ryan says.

Based in Grand Rapids, Mich., RF IDentics designs systems and assembles RFID tags and labels and will manufacture tags and labels based on IFC’s designs. The partnership will produce a range of Gen 1 and Gen 2 EPCglobal tags and labels starting in volume next year.

“We have working tags now, and we will have tags in the market in the second quarter of 2005 in reasonable quantities, producing in the tens of millions in 2005,” says Ryan.

IFC believes its technology can also be used to manufacture siliconless chips for RFID tags and labels. “We have a technology road map to a low-cost next-generation tag using different materials other than silicon,” Ryan says.

Cutting costs in tag production will be essential for tag producers to stay competitive, according to Ryan. “Tags will become a commoditized market sooner rather than later, and the IPD process gives us a stay-ahead technology road map for RFID. Now we have a clear path to lower RFID costs, increased yields and higher-performance tags,” he says.

RFID Journal Home
  • Previous Page
  • 1
  • Next Page

Login and post your comment!

Not a member?

Signup for an account now to access all of the features of RFIDJournal.com!

PREMIUM CONTENT
Case Studies Features Best Practices How-Tos
RFID JOURNAL EVENTS
Live Events Virtual Events Webinars
ASK THE EXPERTS
Simply enter a question for our experts.
TAKE THE POLL
JOIN THE CONVERSATION ON TWITTER
Loading
RFID Journal LIVE! RFID in Health Care LIVE! LatAm LIVE! Brasil LIVE! Europe RFID Connect Virtual Events RFID Journal Awards Webinars Presentations
© Copyright 2002-2014 RFID Journal LLC.
Powered By: Haycco