What is the recommended thickness and stiffness specification for an inlay composed of paper or Teslin for an e-passport cover?
From the spec sheets I have seen for inlays designed for use with e-passports, they usually measure around 300 to 400 micrometers (0.012 to 0.016 inch) thick, or 500 to 650 micrometers (0.02 to 0.026 inch) for inlays designed to be bonded directly to the cover. I suggest you contact the chip manufacturer to ascertain its recommendation if you are developing your own inlay for this purpose.
—Mark Roberti, Founder and Editor, RFID Journal
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