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RFID Packaging
by Rob Carson, posted 07/24/2005
I invite you to visit our website, www.innovatier.com, and learn more about our new patented Reaction Injection Embedding technique that is now being used to encapsulate RFID components into a ruggidized package.
The versatility of our molding process provides a wide range of shapes and forms that can be used without compromising component integrity while significantly enhancing the strength of your finished device. Message threads
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