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RFID Packaging
by Rob Carson, posted 07/24/2005

I invite you to visit our website, www.innovatier.com, and learn more about our new patented Reaction Injection Embedding technique that is now being used to encapsulate RFID components into a ruggidized package.

The versatility of our molding process provides a wide range of shapes and forms that can be used without compromising component integrity while significantly enhancing the strength of your finished device.





Message threads
Topic Author Date
RFID Packaging Anonymous 07/24/2005

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