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Jul 13, 2017—
Nordson EFD Intros Dispensing Paste for RFID Bonding Applications
Nordson EFD, a manufacturer of precision fluid dispensing systems, has announced its new SolderPlus dispensing paste formula. According to Nordson EFD, SolderPlus is intended to improve bond reliability in RFID tags, dual interface (DI) smart cards and biometric passports.
Such applications require the attachment of an antenna electrically connected to a chip. Manufacturers often use a silver-filled epoxy to bond these components, the company explains, but this requires a curing process, which can affect bond strength if insufficient time is allotted for complete curing. Other process considerations include storage temperature requirements of -32 degrees Fahrenheit (0 degrees Celsius). The process of applying solder paste is faster and easier, according to Nordson EFD, since no curing time is required. What's more, solder paste can be stored at a higher temperature, requiring less time to thaw.
According to the company, the chemistry of solder paste makes it safer to use when compared to the chemistry of silver-filled epoxy, which contains toxic materials. Solder paste is also less expensive because it contains no silver.
"We believe each of these factors make our specialized formula of EFD SolderPlus dispense paste a more reliable, cost-effective alternative to other methods used in RFID bonding applications," Mysson said in the prepared statement. "The reliability of solder joints is 20 times better than existing standard connections. When paired with faster production time, this allows DI smart card and RFID tag manufacturers to improve the quality and reliability of their product while meeting increasing consumer demand."
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